PCB stack up: four pieces of single-layer FPC lamination by bonding sheet
Substrate: 0.5 mil PI
Copper: 0.5 oz RA copper
PTH: 0.25 mm diameter Min.
Sold mask at rigd area: green LPI (Liquid Photoimable Ink)
Flexible area: PI coverlay
Surface finish: ENIG (immersion gold)
Our advantage: good registration between layers, material deformation control and find sold mask coverability bring us high in-process yield and cost-efficient manufacturing for multilayer FPC
Key Contact:
Mr
Qiu,
Jack
Manager
Oversea Department
Ms
Zhang,
Bella
Overseas Department
Supplier and product information updated May 25, 2012.
Verified Business Registration Details
Registered Company:
厦门市光莆电子有限公司
* In some jurisdictions, company names and addresses are registered in Chinese only.
